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                CIS

                ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

                AUTOPIA

                Automatic Active Alignment System (for Automotive Camera Application)

                COSMOS

                Automatic 3D Sensing Alignment System

                Eagle AERO

                For High-end IC Applications

                Lens Holder Attach System

                IS600GS

                Automatic Active Alignment Bonding System for Camera Module Assembly

                Lens Holder Attach System

                IS868LA3

                Automatic Lens Holder Attach System

                DI-water Cleaning System

                ISCM868S

                Automatic DI-Water Cleaning System

                ISLinDA

                Automatic Die Bonding System (12” wafer handling)

                Ball Bonder OPTO/LED Wire Bonding Equipment

                Harrier Xtreme

                Dual-Head Extreme High Speed Wire Bonder

                OPTO/LED Wire Bonding Equipment

                iHawk Xpress XL

                Wire Bonder

                Ball Bonder OPTO/LED Wire Bonding Equipment

                iHawk Xtreme

                Wire Bonder

                Strip Form Substrates AOI System

                VIM300 / IS-VIM300

                Automated Optical Inspection

                Other Applications

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